MCIMX503CVM8B datasheet(23/134 Pages) FREESCALE

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Electrical Characteristics

i.MX50 Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

4.1.2.2

13 x 13 mm PoPBGA Package

Thermal Resistance Data

Table 9 provides thermal resistance data for a 13 x 13 mm PoPBGA package.

4.1.2.3

17 x 17 mm MAPBGA Package

Thermal Resistance Data

Table 10 provides thermal resistance data for a 17 x 17 mm MAPBGA package.

Table 9. 13 x 13 mm PoPBGA Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.

Single layer board (1s)

RθJA

°C/W

Junction to Ambient (natural convection)1, 2, 3

3 Per JEDEC JESD51-6 with the board horizontal.

Four layer board (2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board (1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Four layer board (2s2p)

RθJMA

°C/W

Junction to Board4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—

RθJB

°C/W

Junction to Case5

5 Thermal resistance between the die and the case top surface as measured by using the cold plate method (MIL SPEC-883

Method 1012.1).

—

RθJC

6°C/W

Junction to Package Top (natural convection)6

6 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as

Psi-JT.

—

2°C/W

Table 10. 17 x 17 mm MAPBGA Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification.

Single layer board (1s)

RθJA

°C/W

Junction to Ambient (natural convection)1, 2, 3

Four layer board (2s2p)

RθJA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board (1s)

RθJMA

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Four layer board (2s2p)

RθJMA

°C/W

Junction to Board4

—

RθJB

°C/W

Junction to Case5

—

RθJC

8°C/W

Junction to Package Top (natural convection)6

—

2°C/W

MCIMX503CVM8B Datasheet(PDF) 23 Page - Freescale Semiconductor, Inc

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