MB95F613K datasheet(107/110 Pages) CYPRESS

107 / 110 page

Document Number: 002-04698 Rev. *A

Page 107 of 110

PRELIMINARY

MB95610H Series

21. Package Dimension

80-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

12.00 mm

× 12.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.47 g

80-pin plastic LQFP

(FPT-80P-M37)

2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2

120

INDEX

*12.00±0.10(.472±.004)SQ

14.00±0.20(.551±.008)SQ

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

0.145±0.055

(.006±.002)

0.08(.003)

"A"

(Stand off)

Details of "A" part

(.004±.002)

0.10±0.05

(.024±.006)

0.60±0.15

(.020±.008)

0.25(.010)

0.50±0.20

(Mounting height)

.059 –.004

+.008

–

0.10

+0.20

1.50

0~8°

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

MB95F613K Datasheet(PDF) 107 Page - Cypress Semiconductor

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