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TMS320F28076PZP Datasheet(PDF) 43 Page - Texas Instruments |
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TMS320F28076PZP Datasheet(HTML) 43 Page - Texas Instruments |
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43 / 192 page ![]() (2) lfm = linear feet per minute 7.8 Thermal Design Considerations Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions. www.ti.com TMS320F28076, TMS320F28075 SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: TMS320F28076 TMS320F28075 |
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