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TMS320F28076PZP Datasheet(PDF) 44 Page - Texas Instruments |
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TMS320F28076PZP Datasheet(HTML) 44 Page - Texas Instruments |
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44 / 192 page ![]() 7.9 System 7.9.1 Power Management 7.9.1.1 Internal 1.2-V VREG The internal VREG is supplied by VDDIO and generates the 1.2 V required to power the VDD pins. Enable this functionality by pulling the VREGENZ pin low to VSS. Although the internal VREG eliminates the need to use an external power supply for VDD, decoupling capacitors are required on each VDD pin for VREG stability (see the description of VDD in Section 6.2.1). Driving an external load with the internal VREG is not supported. 7.9.1.2 Power Sequencing 7.9.1.2.1 Signal Pin Requirements Before powering the device, no voltage larger than 0.3 V above VDDIO can be applied to any digital pin, and no voltage larger than 0.3 V above VDDA can be applied to any analog pin (including VREFHI). 7.9.1.2.2 VDDIO, VDDA, VDD3VFL, and VDDOSC Requirements The 3.3-V supplies should be powered up together and kept within 0.3 V of each other during functional operation. 7.9.1.2.3 VDD Requirements When VREGENZ is tied to VSS, the VDD sequencing requirements are handled by the device. When using an external source for VDD (VREGENZ tied to VDDIO), VDDOSC and VDD must be powered on and off at the same time. VDDOSC should not be powered on when VDD is off. During the ramp, VDD should be kept no more than 0.3 V above VDDIO. For applications not powering VDDOSC and VDD at the same time, see the "INTOSC: VDDOSC Powered Without VDD Can Cause INTOSC Frequency Drift" advisory in the TMS320F2807x MCUs Silicon Errata. There is an internal 12.8-mA current source from VDD3VFL to VDD when the flash is active. When the flash is active and the device is in a low-activity state (for example, a low-power mode), this internal current source can cause VDD to rise to approximately 1.3 V . There will be zero current load to the external system VDD regulator while in this condition. This is not an issue for most regulators; however, if the system voltage regulator requires a minimum load for proper operation, then an external 82Ω resistor can be added to the board to ensure a minimal current load on VDD. See the "Low-Power Modes: Power Down Flash or Maintain Minimum Device Activity" advisory in the TMS320F2807x MCUs Silicon Errata. 7.9.1.2.4 Supply Ramp Rate The supplies should ramp to full rail within 10 ms. Section 7.9.1.2.4.1 shows the supply ramp rate. 7.9.1.2.4.1 Supply Ramp Rate MIN MAX UNIT Supply ramp rate VDDIO, VDD, VDDA, VDD3VFL, VDDOSC with respect to VSS 330 105 V/s 7.9.1.2.5 Supply Supervision An internal power-on-reset (POR) circuit keeps the I/Os in a high-impedance state during power up. External supply voltage supervisors (SVS) can be used to monitor the voltage on the 3.3-V and 1.2-V rails and drive XRS low when supplies are outside operational specifications. Note If the supply voltage is held near the POR threshold, then the device may drive periodic resets onto the XRS pin. TMS320F28076, TMS320F28075 SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021 www.ti.com 44 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMS320F28076 TMS320F28075 |
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