DLPA2005 datasheet(53/60 Pages) TI

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Device Nomenclature

11.1.2.1 Device Markings

Terminal A1 corner identifier

DLPC1438XXX

XXXXXXXXXX-TT

YMZLLLS

TW YYWW

DLPC1438

Marking Definitions:

Line 1:

DLP® Device Name: DLPC1438 device name ID.

SC: Solder ball composition

e1: Indicates lead-free solder balls consisting of SnAgCu

G8: G indicates mold compound green; 8 indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with

silver content less than or equal to 1.5% and that the mold compound meets TI's definition of green.

Line 2:

TI Part Number

DLP® Device Name: DLPC1438 = x indicates 8 device name ID.

XXX corresponds to the device package designator.

Line 3:

XXXXXXXXXX-TT Manufacturer part number

Line 4:

Foundry lot code for semiconductor wafers and lead-free solder ball marking

YM: Year month date code

Z: Site code

LLL: Assembly lot code

S: Site code

May also be in the format LLLLLL.ZZZ

LLLLLL: Fab lot number

ZZZ: Lot split number

Line 5:

PH YYWW: Package assembly information

PH: Manufacturing site

YYWW: Date code (YY = Year :: WW = Week)

www.ti.com

DLPC1438

DLPS216A – JULY 2021 – REVISED AUGUST 2021

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Product Folder Links: DLPC1438

DLPA2005 Datasheet(PDF) 53 Page - Texas Instruments

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