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DLPA2005 Datasheet(PDF) 54 Page - Texas Instruments |
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DLPA2005 Datasheet(HTML) 54 Page - Texas Instruments |
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54 / 60 page ![]() Note 1. Engineering prototype samples are marked with an X suffix appended to the TI part number. For example, 2512737-0001X. 11.2 Documentation Support 11.2.1 Related Documentation The following table lists quick access links for associated parts of the DLP chipset. Table 11-1. Chipset Documentation PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE DLPA2000 Click here Click here Click here Click here DLPA2005 Click here Click here Click here Click here DLPA3000 Click here Click here Click here Click here DLPA3005 Click here Click here Click here Click here DLP300S Click here Click here Click here Click here DLP301S Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.5 Trademarks TI E2E™ is a trademark of Texas Instruments. DLP® are registered trademarks of Texas Instruments. Arm® and Cortex® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. is a registered trademark of Texas Instruments. All trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information For the device mechanical, packaging, and orderable information, refer to the Mechanical, Packaging, and Orderable Information section of the data sheet available in the DLPC1438 product folder. DLPC1438 DLPS216A – JULY 2021 – REVISED AUGUST 2021 www.ti.com 54 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DLPC1438 |
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