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LTC3889 Datasheet(PDF) 69 Page - Analog Devices |
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LTC3889 Datasheet(HTML) 69 Page - Analog Devices |
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69 / 118 page ![]() LTC3888/LTC3888-1/ LTC3888-2 69 Rev. B For more information www.analog.com INTERNAL REGULATOR OUTPUTS The INTVCC pin provides supply current for much of the internal LTC3888 analog circuitry at a nominal value of 5.2V. The LTC3888 features an internal linear regulator that can be used to supply 5.2V to INTVCC from the pri- mary VIN supply. At lower supply voltages, the LTC3888 will also accept an external 5V supply attached to this pin if VIN and INTVCC are shorted. If the internal 5.2V LDO is used, INTVCC must be bypassed to GND with a low ESR X5R or X7R ceramic capacitor with a value between 1µF and 4.7μF. If an external 5V source supplies VIN and INTVCC, a local low ESR bypass capacitor with a value between 0.01μF and 0.1μF should be placed directly between the shorted power pins and GND. INTVCC powers secondary internal 3.3V and 2.5V LDOs whose outputs are present on VDD33 and VDD25, respec- tively. The 3.3V supply provides power for internal aux- illary circuits, and the 2.5V supply provides power for much of the internal processor logic on the LTC3888. Both of these LDO outputs should be bypassed directly to GND with a low ESR X5R or X7R ceramic capacitor with a value of 1μF or greater. Do not draw any external system current from these LDO supplies beyond that required for specific LTC3888 con- figuration or load/pull-up resistors. IC JUNCTION TEMPERATURE The user must ensure that the maximum rated junction temperature is not exceeded under all operating condi- tions. The thermal resistance of the LTC3888 package (θJA) is 36°C/W, provided the exposed pad is in good thermal contact with the PCB. The actual thermal resis- tance in the application will depend on forced air cooling and other heat sinking means, especially the amount of copper on the PCB to which the LTC3888 is attached. The following formula may be used to estimate the maximum average power dissipation PD (in watts) of the LTC3888. PD = VIN(.03 + IEXT + IRC25) APPLICATIONS INFORMATION Table 12. Resistor Programming of MFR_ADDRESS RCONFIG (kΩ) ASEL1 ASEL0 DEVICE ADDRESS BITS[6:4] DEVICE ADDRESS BITS[3:0] BINARY HEX BINARY HEX OPEN from EEPROM from EEPROM 11.8 1111 F 10.2 1110 E 9.31 1101 D 8.66 1100 C 7.87 1011 B 7.15 1010 A 6.49 1001 9 5.9 1000 8 5.11 0111 7 0111 7 4.42 0110 6 0110 6 3.74 0101 5 0101 5 3.09 0100 4 0100 4 2.43 0011 3 0011 3 1.74 0010 2 0010 2 1.02 0001 1 0001 1 GND 0000 0 0000 0 |
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