MF2DL1000DA4SLASH02 datasheet(21/132 Pages) NXP

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NXP Semiconductors

MF2DL(H)x0

MIFARE DESFire Light contactless application IC

MF2DL_H_x0

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.3 — 5 April 2019

COMPANY PUBLIC

430733

21 / 132

8.6 Backup management

MF2DL(H)x0 supports the implementation of transactions with tearing protection by its

backup file management. The following file types are backup file types:

• Value

• CyclicRecord

• TMC and TMV inside the TransactionMAC file

All updates to these file types will be done only if CommitTransaction is executed

successfully. If the transaction is teared, or an error occurs, before issuing

CommitTransaction, none of the changes issued during the transaction so far will be

applied.

If the card is teared during the CommitTransaction execution itself, the implementation

will still ensure that either all, or none of the changes are applied. Note that it is possible

that the reader will not receive the response to CommitTransaction despite a successful

execution, i.e. when tearing on the response transmission. The chance for this to occur

is limited by a short execution time of the CommitTransaction command. However, still

some system level measures should be considered for this event.

Note that files of StandardData do not offer this backup mechanism. However, still a

limited tearing protection is offered by ensuring that on single frame write operations the

updated data is either completely written or not changed at all.

8.7 Product originality

MF2DL(H)x0 supports two types of originality check: one based on an LRP

authentication with AES originality keys and another one with a static signature

verification with an ECC public key. For detail of the ECC originality check, refer to

originality check commands.

The AES-based originality verification using AuthenticateLRPFirst or

AuthenticateLRPNonFirst is done with one of the OriginalityKey described in

Section 8.2.4.

MF2DL1000DA4/02 Datasheet(PDF) 21 Page - NXP Semiconductors