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ISL73141SEHF7/PROTO Datasheet(PDF) 26 Page - Renesas Technology Corp

Part # ISL73141SEHF7/PROTO
Description  Radiation Hardened 14-Bit 1MSPS SAR ADC
PDF  30 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL73141SEHF7/PROTO Datasheet(HTML) 26 Page - Renesas Technology Corp

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R34DS0012EU0504 Rev.5.04
Page 26
Sep 18, 2025
ISL73141SEH Datasheet
specifications, the settling time must be met for the input signals on the analog input of the ISL73141SEH. To
accurately resolve to 1 LSB, the settling time is defined by Equation 3:
Simplifying this results in Equation 4:
Solving for t results in:
, which can be written as
and further simplified to
.
Settling time is t, RS ×CP is τ, and the resolution of the ADC is N.
The ISL73141SEH is a 14-bit ADC, which means the settling time to attain 1 LSB accuracy is 9.7 × τ. For
example, the ISL73141SEHEV1Z evaluation board employs a 24Ω resistor for RS and a 470pF capacitor for CP,
which means that the required settling time would be t = 0.693 × 14 × 24Ω × 470pF = 109.4ns. If different RS and
CP values are used, calculate the settling time for those conditions. These calculations assume the settling time of
the input network RS and CP are much larger than the settling time of any amplifier driving the ISL73141SEH
analog input. If this is not the case, the settling time of the input network must be root-sum-squared with the
settling time of the amplifier to determine the required settling time using Equation 5:
6.
Die and Assembly Characteristics
(EQ. 3)
(EQ. 4)
(EQ. 5)
Table 1.
Die and Assembly Related Information
Die Information
Dimensions
2410µm x 3910µm (95 mils x 154 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
Passivation
Oxide/Nitride Total Thickness 24.5 kÅ
Top Metallization
Top metal/Bond Pad Composition
99.5% Al, 0.5%Cu
Process
0.25um CMOS
Assembly Information
Substrate Potential
GND
Additional Information
Transistor Count
37700
Weight of Packaged Device
0.572 grams (typical) - K14.A package
Lid Characteristics
Finish: Gold
Lid Potential: Connected to package Pin 14 (DGND)
1
2
N
-------
e
t
–
=
2
N

ln
t
--
–
=
t-
2
N

ln
=
tN
2

ln
=
t
0.693 N

=
ttAMP

2
tRC

2
+
=



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