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LPC1547JBD48 Datasheet(PDF) 87 Page - NXP Semiconductors |
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LPC1547JBD48 Datasheet(HTML) 87 Page - NXP Semiconductors |
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87 / 99 page  LPC15XX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved. Product data sheet Rev. 1 — 19 February 2014 87 of 99 NXP Semiconductors LPC15xx 32-bit ARM Cortex-M3 microcontroller 14.3 XTAL Printed-Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plane. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Smaller values of Cx1 and Cx2 should be chosen according to the increase in parasitics of the PCB layout. 5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 200 39 pF, 39 pF 30 pF < 100 57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 60 39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF Table 33. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF Table 32. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 |
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