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LPC1547JBD48 Datasheet(PDF) 93 Page - NXP Semiconductors |
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LPC1547JBD48 Datasheet(HTML) 93 Page - NXP Semiconductors |
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93 / 99 page ![]() LPC15XX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved. Product data sheet Rev. 1 — 19 February 2014 93 of 99 NXP Semiconductors LPC15xx 32-bit ARM Cortex-M3 microcontroller Fig 53. Reflow soldering for the LQFP64 package SOT314-2 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP64 package Ax Bx Gx Gy Hy Hx Ay By P1 P2 D2 (8 ×) D1 (0.125) Ax Ay Bx By D1 D2 Gx Gy Hx Hy 13.300 13.300 10.300 10.300 P1 0.500 P2 0.560 0.280 C 1.500 0.400 10.500 10.500 13.550 13.550 sot314-2_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout |
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