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AN4650 Datasheet(PDF) 1 Page - STMicroelectronics |
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AN4650 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 102 page  February 2015 DocID027415 Rev 1 1/102 102 AN4650 Application note LSM6DS3: always-on 3D accelerometer and 3D gyroscope Introduction This document is intended to provide usage information and application hints related to ST’s LSM6DS3 iNEMO inertial module. The LSM6DS3 is a 3D digital accelerometer and 3D digital gyroscope system-in-package with a digital I2C/SPI serial interface standard output, performing at 0.9 mA in combo Normal mode and 1.25 mA (up to 1.6 kHz) in combo High-Performance mode. Thanks to the ultra-low noise performance of both the gyroscope and the accelerometer, the device combines always-on low-power features with superior sensing precision for an optimal motion experience for the consumer. Furthermore, the accelerometer features smart sleep- to-wake-up (Activity) and return-to-sleep (Inactivity) functions that allow advanced power saving. The device has a dynamic user-selectable full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DS3 can be configured to generate interrupt signals by using hardware recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, wake-up events. The availability of different connection modes to external sensors allows implementing additional functionalities such as sensor hub, auxiliary SPI, etc. The LSM6DS3 is compatible with the requirements of Android KitKat, Android L and the leading OSs, offering real, virtual and batch-mode sensors. It has been designed to implement in hardware significant motion, tilt, pedometer functions, time stamp and to support the data acquisition of an external magnetometer with ironing correction (hard, soft). The LSM6DS3 has an integrated smart first-in first-out (FIFO) buffer of up to 8 kbyte size, allowing dynamic batching of significant data (i.e. external sensors, step counter, time stamp and temperature). The LSM6DS3 is available in a small plastic land grid array package (LGA-14L) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. The ultra-small size and weight of the SMD package make it an ideal choice for handheld portable applications such as smartphones, IoT connected devices, and wearables or any other application where reduced package size and weight are required. www.st.com |
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