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DP83867CS Datasheet(PDF) 2 Page - Texas Instruments

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Part # DP83867CS
Description  High Immunity, Small Form Factor 10/100/1000 Ethernet Physical Layer Transceiver
PDF  114 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DP83867CS Datasheet(HTML) 2 Page - Texas Instruments

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DP83867CS, DP83867IS, DP83867E
SNLS504 – OCTOBER 2015
www.ti.com
Table of Contents
9.3
Feature Description................................................. 19
1
Features .................................................................. 1
9.4
Device Functional Modes........................................ 21
2
Applications ........................................................... 1
9.5
Programming .......................................................... 36
3
Description ............................................................. 1
9.6
Register Maps ......................................................... 45
4
System Diagram..................................................... 1
10
Application and Implementation........................ 98
5
Revision History..................................................... 2
10.1
Application Information.......................................... 98
6
Device Comparison ............................................... 3
10.2
Typical Application ............................................... 98
7
Pin Configuration and Functions ......................... 3
11
Power Supply Recommendations ................... 102
7.1
Unused Pins............................................................. 6
12
Layout................................................................. 104
8
Specifications......................................................... 7
12.1
Signal Traces ...................................................... 104
8.1
Absolute Maximum Ratings ...................................... 7
12.2
Return path ......................................................... 104
8.2
ESD Ratings.............................................................. 7
12.3
Transformer Layout............................................. 105
8.3
Recommended Operating Conditions ....................... 7
12.4
Metal Pour........................................................... 105
8.4
Thermal Information .................................................. 8
12.5
PCB Layer Stacking ............................................ 105
8.5
Electrical Characteristics........................................... 8
12.6
Layout Example .................................................. 106
8.6
Powerup Timing ..................................................... 10
13
Device and Documentation Support ............... 107
8.7
Reset Timing ........................................................... 11
13.1
Documentation Support ..................................... 107
8.8
MII Serial Management Timing ............................... 12
13.2
Related Links ...................................................... 107
8.9
SGMII Timing .......................................................... 13
13.3
Community Resources........................................ 107
8.10
RGMII Timing ........................................................ 14
13.4
Trademarks ......................................................... 107
8.11
Typical Characteristics .......................................... 16
13.5
Electrostatic Discharge Caution .......................... 107
9
Detailed Description ............................................ 17
13.6
Glossary .............................................................. 107
9.1
Overview ................................................................. 17
14
Mechanical, Packaging, and Orderable
9.2
Functional Block Diagram ....................................... 18
Information ......................................................... 107
5 Revision History
DATE
REVISION
NOTES
October 2015
*
Initial release.
2
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Copyright © 2015, Texas Instruments Incorporated



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