TNETV1647GSTZWT datasheet(232/236 Pages) TI1

232 / 236 page

TMS320DM6441

SPRS359E – SEPTEMBER 2006 – REVISED AUGUST 2010

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Mechanical Packaging and Orderable Information

The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical

package.

7.1

Thermal Data for ZWT

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

6.54

N/A

ΘJB

Junction-to-board

15.62

N/A

29.75

0.00

26.78

1.0

ΘJA

Junction-to-free air

26.20

2.00

25.80

3.00

0.11

0.00

0.15

1.0

PsiJT

Junction-to-package top

0.16

2.00

0.16

3.00

14.79

0.00

14.66

1.0

PsiJB

Junction-to-board

14.66

2.00

14.66

3.00

(1)

These measurements were conducted in a JEDEC defined 1S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages.

(2)

m/s = meters per second

7.2

Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

232

Mechanical Packaging and Orderable Information

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