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TNETV1647GSTZWT Datasheet(PDF) 233 Page - Texas Instruments |
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TNETV1647GSTZWT Datasheet(HTML) 233 Page - Texas Instruments |
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233 / 236 page  PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples SN3490586 NRND NFBGA ZWT 361 90 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR DM6441AZWT TMS320 DAVINCI TMS320DM6441AZWT NRND NFBGA ZWT 361 90 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR DM6441AZWT TMS320 DAVINCI TMS320DM6441BZWT NRND NFBGA ZWT 361 90 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR DM6441BZWT TMS320 DAVINCI TMS320DM6441ZWT OBSOLETE NFBGA ZWT 361 TBD Call TI Call TI DM6441ZWT TMS320 DAVINCI TNETV1647GSTZWT NRND NFBGA ZWT 361 90 Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR DM6441AZWT TMS320 DAVINCI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. |
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