DSPIC33EP128GS708 datasheet(380/484 Pages) MICROCHIP

380 / 484 page

dsPIC33EPXXXGS70X/80X FAMILY

DS70005258C-page 380

 2016-2018 Microchip Technology Inc.

30.1

DC Characteristics

TABLE 30-1:

OPERATING MIPS vs. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temperature Range

(in °C)

Maximum MIPS

dsPIC33EPXXXGS70X/80X Family

—

3.0V to 3.6V(1)

-40°C to +85°C

—

3.0V to 3.6V(1)

-40°C to +125°C

Note 1:

Device is functional at VBORMIN < VDD < VDDMIN. Analog modules (ADC, PGAs and comparators)

may have degraded performance. Device functionality is tested but not characterized. Refer to

Parameter BO10 in Table 30-13 for the minimum and maximum BOR values.

TABLE 30-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min.

Typ.

Max.

Unit

Industrial Temperature Devices

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

Extended Temperature Devices

Operating Junction Temperature Range

-40

—

+140

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –

 IOH)

PINT + PI/O

I/O Pin Power Dissipation:

I/O =

 ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

JA

TABLE 30-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ.

Max.

Unit

Notes

Package Thermal Resistance, 80-Pin TQFP 12x12x1 mm

JA

53.0

—

°C/W

Package Thermal Resistance, 64-Pin TQFP 10x10x1 mm

JA

49.0

—

°C/W

Package Thermal Resistance, 48-Pin TQFP 7x7x1 mm

JA

63.0

—

°C/W

Package Thermal Resistance, 44-Pin QFN 8x8 mm

JA

29.0

—

°C/W

Package Thermal Resistance, 44-Pin TQFP 10x10x1 mm

JA

50.0

—

°C/W

Package Thermal Resistance, 28-Pin QFN-S 6x6x0.9 mm

JA

30.0

—

°C/W

Package Thermal Resistance, 28-Pin UQFN 6x6x0.55 mm

JA

26.0

—

°C/W

Package Thermal Resistance, 28-Pin SOIC 7.50 mm

JA

70.0

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-JA (

JA) numbers are achieved by package simulations.

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