PAC1721 datasheet(84/92 Pages) MICROCHIP

84 / 92 page

PAC1721

DS-20007088A-page 84

 2026 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.20 REF

0.35

0.25

0.80

0.00

0.30

0.45

0.90

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

0.55

0.35

1.00

0.05

MAX

0.65 REF

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

0.35

3.00 BSC

0.45

0.55

Wettable Flank Step Cut Length

0.035

0.060

0.085

0.10

0.19

Wettable Flank Step Cut Height

0.20

0.30

0.40

Index Corner Chamfer

0.15 REF

8-Lead Very Thin Plastic Dual Flat, No Lead Package (3PW) - 3x3x1.0 mm Body [VDFN]

With Multiple Exposed Pad and Stepped Wettable Flanks

Microchip Technology Drawing C04-568 Rev B

PAC1721 Datasheet(PDF) 84 Page - Microchip Technology

PAC1721 Datasheet(HTML) 84 Page - Microchip Technology

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