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PAC1721 Datasheet(PDF) 88 Page - Microchip Technology

Part # PAC1721
Description  Single-Channel Power Monitor with Accumulator, 9V Full Scale Range
PDF  92 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PAC1721 Datasheet(HTML) 88 Page - Microchip Technology

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PAC1721
DS-20007088A-page 88
 2026 Microchip Technology Inc. and its subsidiaries
Microchip Technology Drawing C04-02206 Rev D
10-Lead Very Thin Plastic Dual Flat, No Lead Package (9QX) - 3x3 mm Body [VDFN]
SILK SCREEN
1
2
2.40
1.70
MILLIMETERS
0.50 BSC
MIN
E
MAX
0.28
Contact Pad Length (X10)
Contact Pad Width (X10)
Y1
X1
0.80
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
NOM
C
Contact Pad Spacing
3.00
Contact Pad to Contact Pad (X8)
G1
0.20
Contact Pad to Center Pad (X10)
G2
0.25 REF
REF: Reference Dimension, usually without tolerances, for reference only.
Thermal Via Diameter
V
Thermal Via Pitch
VX
Thermal Via Pitch
VY
0.30
1.00
1.00
2X CH
VY
VX
ØV
X2
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
G1
Y1
Y2
(G2)
X1
10
Dimension Limits
Units
CH
Optional Center Pad Width
Center Pad Chamfer
Optional Center Pad Length
Contact Pitch
X2
Y2
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
2.
Dimensioning and tolerancing per ASME Y14.5M
E



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