PAC1721 datasheet(85/92 Pages) MICROCHIP

85 / 92 page

 2026 Microchip Technology Inc. and its subsidiaries

DS-20007088A-page 85

PAC1721

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width (X4)

Center Pad Length (X4)

Contact Pitch

0.35

0.55

MILLIMETERS

0.65 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.90

0.35

NOM

Contact Pad Spacing

2.80

Center Pad to Center Pad

0.21

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Center Pad to Center Pad

0.43

Microchip Technology Drawing C04-2568 Rev B

Contact Pad to Contact Pad (X6)

0.30

Contact Pad to Center Pad (X8)

0.50

SILK SCREEN

8-Lead Very Thin Plastic Dual Flat, No Lead Package (3PW) - 3x3x1.0 mm Body [VDFN]

With Multiple Exposed Pad and Stepped Wettable Flanks

PAC1721 Datasheet(PDF) 85 Page - Microchip Technology

PAC1721 Datasheet(HTML) 85 Page - Microchip Technology

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