LPC2921 datasheet(70/81 Pages) PHILIPS

70 / 81 page

LPC2921_2923_2925_0

Preliminary data sheet

Rev. 00.01 — 24 October 2008

70 of 81

NXP Semiconductors

LPC2921/2923/2925

ARM9 microcontroller with CAN and LIN

9.6 Dynamic characteristics: ADC1/2

[1]

All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb =125 °C ambient

temperature on wafer level. Cased products are tested at Tamb =25 °C (final testing). Both pre-testing and final testing use correlated

test conditions to cover the specified temperature and power supply voltage range.

[2]

Duty cycle clock should be as close as possible to 50 %.

10. Application information

10.1 Operating frequency selection

Table 37.

ADC dynamic characteristics

VDD(CORE) =VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to

ground.[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fi(ADC)

ADC input frequency

[2] 4-

4.5

MHz

fs(max)

maximum sampling rate

fi(ADC) = 4.5 MHz;

fs =fi(ADC)/(n + 1) with

n=resolution

resolution 2 bit

1500

ksampl

e/s

resolution 10 bit

400

ksampl

e/s

tconv

conversion time

In number of ADC

clock cycles

cycles

In number of bits

bits

Fig 27. LPC29xx core operating frequency versus temperature for different core

voltages.

temperature (

°C)

002aae194

125

115

135

145

core

frequency

(MHz)

105

VDD(CORE) = 1.95 V

VDD(CORE) = 1.8 V

VDD(CORE) = 1.65 V

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