DAC39J84IAAVR datasheet(6/146 Pages) TI

6 / 146 page

DAC39J84

SLASE48A – NOVEMBER 2014 – REVISED JANUARY 2015

www.ti.com

Pin Functions (continued)

I/O

DESCRIPTION

NAME

NUMBER

Internal clock buffer supply voltage (0.9V). It is recommended to isolate this supply from

VDDCLK09

A8, B8

VDDDIG09.

D9, E9, F9, G9,

VDDDAC09

DAC core supply voltage. (0.9V). It is recommended to isolate this supply from VDDDIG09.

H9, J9

J7, J6, D5, J5,

Digital supply voltage. (0.9V). It is recommended to isolate this supply from VDDCLK09 and

VDDDIG09

D4, E4, F4, G4,

VDDDAC09.

H4, J4, D3

VDDIO18

K7, K6

Supply voltage for all digital I/O and CMOS I/O. (1.8V)

VDDR18

F2, G2

Supply voltage for SerDes (1.8V)

VDDS18

C7, C6

Supply voltage for LVDS SYNCBP/N (1.8V)

VDDT09

F3, G3

Supply voltage for SerDes termination (0.9V)

Fuse supply voltage. This supply pin is also used for factory fuse programming. Connect to

VQPS18

D7, D6

1.8V.

VSENSE

I/O

Analog test pin for on chip parametric. It can be left open if not used.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDDDAC09, VDDDIG09

–0.3

1.3

VDDCLK09

–0.3

1.3

VDDT09

–0.3

1.3

Supply Voltage

Range(2)

VDDR18, VDDIO, VDDS18, VQPS18

–0.3

2.45

VDDAPLL18, VDDAREF18

–0.3

2.45

VDDADAC33

–0.3

4.0

RX[7..0]P/N

–0.5

VDDT09 + 0.5 V

SDENB, SCLK, SDIO, SDO, TXENA, ALARM, RESETB, SLEEP, TMS,

–0.5

VDDIO18 + 0.5 V

TCLK, TDI, TDO, TRSTB, TESTMODE, SYNC_N_AB, SYNC_N_CD

DACCLKP/N, SYSREFP/N

–0.5

VDDAPLL18 + 0.5 V

Terminal

SYNCBP/N

–0.5

VDDS18 + 0.5 V

Voltage

LPF

–0.5

VDDAPLL18 + 0.5 V

Range(2)

IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N

–0.5

1.0 V

RBIAS, EXTIO, ATEST

–0.5 VDDAREF18 + 0.5 V

IFORCE, VSENSE

–0.5

VDDDIG09 + 0.5 V

AMUX1, AMUX0

–0.5

VDDT09 + 0.5 V

Peak input current (any input)

Peak total input current (all inputs)

–30

Absolute maximum junction temperature TJ

150

°C

Operating free-air temperature, TA: DAC39J84

–40

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Measured with respect to GND.

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