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DS20006554A Datasheet(PDF) 7 Page - Microchip Technology |
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DS20006554A Datasheet(HTML) 7 Page - Microchip Technology |
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7 / 94 page ![]() ZL30260-ZL30263 Data Sheet 7 © 2021 Microchip Technology Inc. DS20006554A 4. Pin Descriptions All device inputs and outputs are LVCMOS unless described otherwise. The Type column uses the following symbols: I – input, O – output, A – analog, P – power supply pin. All GPIO and SPI/I2C interface pins have Schmitt-trigger inputs and have output drivers that can be disabled (high impedance). Table 1 - Pin Descriptions Pin # Name Type Description 15, 16 18, 19 20 IC1P, IC1N IC2P, IC2N IC3P I I I Input Clock Pins Differential or Single-ended signal format. Programmable frequency. Differential: See Table 9 for electrical specifications, and see Figure 15 for recommended external circuitry for interfacing these differential inputs to LVDS, LVPECL, CML or HSCL output pins on neighboring devices. Single-ended: For input signal amplitude >2.5V, connect the signal directly to ICxP pin. For input signal amplitude ≤2.5V, AC-coupling the signal to ICxP is recommended. Connect the N pin to a capacitor (0.1 F or 0.01F) to VSS. As shown in Figure 15, the ICxP and ICxN pins are internally biased to approximately 1.3V. Treat the ICxN pin as a sensitive node; minimize stubs; do not connect to anything else including other ICxN pins. Unused: Set ICEN.ICxEN=0. The ICxP and ICxN pins can be left floating. Note that the IC3N pin is not bonded out. A differential signal can be connected to IC3P by AC-coupling the POS trace to IC3P and terminating the signal on the driver side of the coupling cap. 12 13 XA XB A / I Crystal or Input Clock Pins Crystal: MCR2.XAB=01. An on-chip crystal driver circuit is designed to work with an external crystal connected to the XA and XB pins. See section 5.3.2 for crystal characteristics and recommended external components. Input Clock: MCR2.XAB=10. An external local oscillator or clock signal can be connected to the XA pin. The XB pin must be left unconnected. The signal on XA can be as large as 3.3V even when VDDH is only 2.5V. 8, 9 6, 5 2, 3 55, 56 53, 52 47, 48 45, 44 41, 40 37, 38 35, 34 OC1P, OC1N OC2P, OC2N OC3P, OC3N OC4P, OC4N OC5P, OC5N OC6P, OC6N OC7P, OC7N OC8P, OC8N OC9P, OC9N OC10P, OC10N O Output Clock Pins LVDS, programmable differential (which includes LVPECL), HCSL, HSTL or 1 or 2 CMOS. Programmable frequency. Programmable VCM and VOD in programmable differential mode. Programmable drive strength in CMOS and HSTL modes. See Figure 17 for example external interface circuitry. See Table 10, Table 11 and Table 12 for electrical specifications for LVDS, LVPECL and HCSL, respectively. See Table 13 for electrical specifications for interfacing to CMOS and HSTL inputs on neighboring devices. Outputs OC2, OC5, OC7 and OC10 are not present on 6-output products. 29 RSTN I Reset (Active Low) When this global asynchronous reset is pulled low, all internal circuitry is reset to default values. The device is held in reset as long as RSTN is low. Minimum low time is 1µs. 23 22 28 AC0/GPIO0 AC1/GPIO1 AC2/GPIO2 I/O Auto-Configure [2:0] / General Purpose I/O 0, 1 and 2 Auto Configure: On the rising edge of RSTN these pins behave as AC[2:0] and specify one of the configurations stored in ROM or EEPROM. See section 5.2. |
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