MSP430F5632IPZ datasheet(46/101 Pages) TI

46 / 101 page

MSP430F563x

SLAS650A – JUNE 2010 – REVISED JULY 2010

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Crystal Oscillator, XT2

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

(1) (2)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fOSC = 4 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 0,

200

TA = 25°C

fOSC = 12 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 1,

260

TA = 25°C

XT2 oscillator crystal current

IDVCC,XT2

3 V

µA

consumption

fOSC = 20 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 2,

325

TA = 25°C

fOSC = 32 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 3,

450

TA = 25°C

XT2 oscillator crystal frequency,

fXT2,HF0

XT2DRIVEx = 0, XT2BYPASS = 0(3)

MHz

mode 0

XT2 oscillator crystal frequency,

fXT2,HF1

XT2DRIVEx = 1, XT2BYPASS = 0(3)

MHz

mode 1

XT2 oscillator crystal frequency,

fXT2,HF2

XT2DRIVEx = 2, XT2BYPASS = 0(3)

MHz

mode 2

XT2 oscillator crystal frequency,

fXT2,HF3

XT2DRIVEx = 3, XT2BYPASS = 0(3)

MHz

mode 3

XT2 oscillator logic-level

fXT2,HF,SW

XT2BYPASS = 1(4) (3)

1.5

MHz

square-wave input frequency

XT2DRIVEx = 0, XT2BYPASS = 0,

450

fXT2,HF0 = 6 MHz, CL,eff = 15 pF

XT2DRIVEx = 1, XT2BYPASS = 0,

320

fXT2,HF1 = 12 MHz, CL,eff = 15 pF

Oscillation allowance for

OAHF

Ω

HF crystals(5)

XT2DRIVEx = 2, XT2BYPASS = 0,

200

fXT2,HF2 = 20 MHz, CL,eff = 15 pF

XT2DRIVEx = 3, XT2BYPASS = 0,

200

fXT2,HF3 = 32 MHz, CL,eff = 15 pF

fOSC = 6 MHz

XT2BYPASS = 0, XT2DRIVEx = 0,

0.5

TA = 25°C,

CL,eff = 15 pF

tSTART,HF

Startup time

3 V

fOSC = 20 MHz

XT2BYPASS = 0, XT2DRIVEx = 3,

0.3

TA = 25°C,

CL,eff = 15 pF

Integrated effective load

CL,eff

capacitance, HF mode(6) (1)

Measured at ACLK, fXT2,HF2 =

Duty cycle

20 MHz

(1)

Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

(2)

To improve EMI on the XT2 oscillator the following guidelines should be observed.

(a) Keep the traces between the device and the crystal as short as possible.

(b) Design a good ground plane around the oscillator pins.

(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.

(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.

(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.

(3)

Maximum frequency of operation of the entire device cannot be exceeded.

(4)

When XT2BYPASS is set, the XT2 circuit is automatically powered down.

(5)

Oscillation allowance is based on a safety factor of 5 for recommended crystals.

(6)

Includes parasitic bond and package capacitance (approximately 2 pF per pin).

Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a

correct setup, the effective load capacitance should always match the specification of the used crystal.

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