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W25Q128FVCIP Datasheet(PDF) 95 Page - Winbond |
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W25Q128FVCIP Datasheet(HTML) 95 Page - Winbond |
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95 / 97 page  W25Q128FV Publication Release Date: October 01, 2012 - 94 - Revision D 11. ORDERING INFORMATION W(1) 25Q 128F V x I(1) (2,3) G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3) P = Green Package with Status Register Power-Down & OTP enabled Q = Green Package with QE=1 in Status Register-2 I = Industrial (-40°C to +85°C) S = 8-pin SOIC 208-mil T = 8-pin VSOP 208-mil A = 8-pin PDIP 300-mil F = 16-pin SOIC 300-mil P = WSON8 6x5-mm E = WSON8 8x6-mm B = TFBGA 8x6-mm (5x5-1 ball array) C = TFBGA 8x6-mm (6x4 ball array) V = 2.7V to 3.6V 128F = 128M-bit 25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O W = Winbond Notes: 1. The “W” prefix and the Temperature designator “I” are not included on the part marking. 2. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or Tray (shape S), when placing orders. 3. For shipments with OTP feature enabled, please specify when placing orders. |
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