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S75WS256NDFBAWMB Datasheet(PDF) 159 Page - SPANSION

Part # S75WS256NDFBAWMB
Description  Stacked Multi-Chip Product (MCP)
PDF  216 Pages
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
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S75WS256NDFBAWMB Datasheet(HTML) 159 Page - SPANSION

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February 17, 2005 S75WS-N-00_A0
S75WS256Nxx Based MCPs
157
Advance
Information
31 Configuration Registers
Two user-accessible configuration registers define the device operation. The bus configuration
register (BCR) defines how the CellularRAM interacts with the system memory bus and is nearly
identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR)
is used to control how refresh is performed on the DRAM array. These registers are automatically
loaded with default settings during power-up, and can be updated any time the devices are op-
erating in a standby state.
31.1
Access Using CRE
The configuration registers can be written to using either a synchronous or an asynchronous op-
eration when the configuration register enable (CRE) input is High (see Figure 31.1 and
Figure 31.2). When CRE is Low, a Read or Write operation will access the memory array. The reg-
ister values are written via address pins A[21:0]. In an asynchronous Write, the values are
latched into the configuration register on the rising edge of ADV#, CE#, or WE#, whichever oc-
curs first; LB# and UB# are Don’t Care. The BCR is accessed when A[19] is High; the RCR is
accessed when A[19] is Low. For Reads, address inputs other than A[19] are Don’t Care, and reg-
ister bits 15:0 are output on DQ[15:0].



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