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LMK05028RGCT.B Datasheet(PDF) 86 Page - Texas Instruments |
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LMK05028RGCT.B Datasheet(HTML) 86 Page - Texas Instruments |
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86 / 94 page  www.ti.com PACKAGE OUTLINE C 9.15 8.85 9.15 8.85 1.0 0.8 0.05 0.00 2X 7.5 60X 0.5 2X 7.5 64X 0.5 0.3 64X 0.30 0.18 7.7 0.1 (0.2) TYP VQFN - 1 mm max height RGC0064J PLASTIC QUAD FLATPACK - NO LEAD 4219012/A 05/2018 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 16 17 32 33 48 49 64 65 SCALE 1.500 A B LMK05028 SNAS724B – FEBRUARY 2018 – REVISED FEBRUARY 2025 www.ti.com 86 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: LMK05028 |
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