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C6416 Datasheet(PDF) 130 Page - Texas Instruments |
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C6416 Datasheet(HTML) 130 Page - Texas Instruments |
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130 / 134 page  SMJ320C6414, SMJ320C6415, SMJ320C6416 FIXEDPOINT DIGITAL SIGNAL PROCESSORS SGUS050A − JANUARY 2004 − REVISED MARCH 2004 130 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 MECHANICAL DATA GAD (S-CPGA-P570) CERAMIC PIN GRID ARRAY NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Flip chip application only D. This package is hermetically sealed with a metal lid. thermal resistance characteristics (S-CPGA package) NO °C/W 1 R ΘJA Junction-to-free air (Low K JEDEC PCB) 20.96 2 R ΘJA Junction-to-free air (High K JEDEC PCB) 16.5 3 R ΘJC Junction-to-case (High K JEDEC PCB with heat sink on lid) 10.9 4 R ΘJC Junction-to-case (High K JEDEC PCB with heat sink on body) 7.69 5 R ΘJB Junction-to-board (High K JEDEC PCB) 9 6 R ΘJB Junction-to-board (High K JEDEC PCB with thermal compound on top of the die) 2.93 |
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