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S75WS256NDFBAWMB Datasheet(PDF) 175 Page - SPANSION

Part # S75WS256NDFBAWMB
Description  Stacked Multi-Chip Product (MCP)
PDF  216 Pages
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S75WS256NDFBAWMB Datasheet(HTML) 175 Page - SPANSION

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February 17, 2005 S75WS-N-00_A0
S75WS256Nxx Based MCPs
173
Advance
Information
Notes:
1. See How Extended Timings Impact CellularRAM™ Operation below.
2. Low-Z to High-Z timings are tested with the circuit shown in Figure 34.2. The High-Z timings measure a 100mV transition from either VOH
or VOL toward VCCQ/2.
3. High-Z to Low-Z timings are tested with the circuit shown in Figure 34.2. The Low-Z timings measure a 100mV transition away from the
High-Z (VCCQ/2) level toward either VOH or VOL.
Table 34.4 Asynchronous Write Cycle Timing Requirements
Parameter
Symbol
70 ns/80 MHz
85 ns/66 MHz
Units
Notes
Min
Max
Min
Max
Address and ADV# Low Setup Time
tAS
00
ns
Address Hold from ADV# Going High
tAVH
55
ns
Address Setup to ADV# Going High
tAVS
10
10
ns
Address Valid to End of Write
tAW
70
85
ns
LB#/UB# Select to End of Write
tBW
70
85
ns
Maximum CE# Pulse Width
tCEM
44
µs
1
CE# Low to Wait Valid
tCEW
1
7.5
1
7.5
ns
Async Address-to-Burst Transition Time
tCKA
70
85
ns
CE# Low to ADV# High
tCVS
10
10
ns
Chip Enable to End of Write
tCW
70
85
ns
Data Hold from Write Time
tDH
00
ns
Data Write Setup Time
tDW
23
23
ns
1
Chip Disable to Wait High-Z Output
tHZ
88
ns
Chip Enable to Low-Z Output
tLZ
10
10
ns
3
End Write to Low-Z Output
tOW
55
ns
3
ADV# Pulse Width
tVP
10
10
ns
ADV# Pulse Width High
tVPH
10
10
ns
ADV# Setup to End of Write
tVS
70
85
ns
Write Cycle Time
tWC
70
85
ns
Write to DQ High-Z Output
tWHZ
88
ns
2
Write Pulse Width
tWP
46
55
ns
1
Write Pulse Width High
tWPH
10
10
ns
Write Recovery Time
tWR
00
ns



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