FS5502 datasheet(83/113 Pages) NXP

83 / 113 page

NXP Semiconductors

FS5502

High voltage PMIC with multiple SMPS and LDO

temperature to satisfy the jump-start requirement of 12 V applications and 35 V load

dump.

24 Thermal characteristics

Symbol

Parameter

Conditions

Min

Max

Unit

RθJA

Thermal resistance junction to

ambient

2s2p circuit board

Step-cut wettable flank

Dimple wettable flank

[1]

—

°C/W

RθJA

Thermal resistance junction to

ambient

2s6p circuit board

Step-cut wettable flank

Dimple wettable flank

[1]

—

°C/W

RθJB

Thermal resistance junction to board 2s2p circuit board

Step-cut wettable flank

Dimple wettable flank

[1]

—

°C/W

RθJB

Thermal resistance junction to board 2s6p circuit board

Step-cut wettable flank

Dimple wettable flank

[1]

—

°C/W

RθJC_BOT

Thermal resistance junction to case

bottom

between the die and the solder pad

on the bottom of the package

Step-cut wettable flank

Dimple wettable flank

[1]

—

1.5

°C/W

RθJP_TOP

Thermal resistance junction to

package top

between package top and the

junction temperature

Step-cut wettable flank

Dimple wettable flank

[1]

—

°C/W

Ambient temperature (Grade 1)

−40

125

°C

Junction temperature (Grade 1)

−40

150

°C

TSTG

Storage temperature

−55

150

°C

Table 79. Thermal ratings

[1]

per JEDEC JESD51-2 and JESD51-8

FS5502

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 27 October 2021

83 / 113

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