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Power and Thermal Characteristics

V 04

Notes for Table 38:

1 Estimated power dissipation (+/-10%) is derived from measurements on the C-5 NP

Revision D00 under following conditions:

• BMU memory operating at 125MHz.

• TLU memory operating at 133MHz.

• V

DD = 1.8V, VDD33 = 3.3V, TJ at approximately 50

o C.

• “Minimum” P

D based on idle condition (clocks running and no programs

executing).

• “Typical” P

D based on test application that implements Fast Ethernet forwarding

actively running on all CPs.

• “Maximum” P

D based on projected maximum consumption for any

high-bandwidth communications application executing on all CPs, FP, and XP.

2 Thermal performance specifications based on following conditions:

• Printed circuit board is based on the C-Ware Development System’s C-5 NP Switch

Module reference design, with specifications of:

– 14 total layers (5 planes). Planes at least 100mm x 100mm below the C-5 NP

before any interruptions.

– FR4 board material, Cu signal and plane material.

– 0.5mils signal layer thickness, 1.4mils plane layer thickness.

– Thermal resistance, board to ambient (

BA) of 1.2

oC/W.

• Custom heat sink design has the following characteristics:

Thermal Resistance, Junction

through Board to Ambient,

JBA

6.0

See Note 2

Effective Thermal Resistance,

effective

1.43

oC/W

See Note 3

Table 38 C-5 Network Processor Power and Thermal Characteristics (continued)

PARAMETER

MIN

TYP

MAX

UNITS

TEST CONDITIONS

Freescale Semiconductor, Inc.

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