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STM32U375CE Datasheet(PDF) 91 Page - STMicroelectronics

Part # STM32U375CE
Description  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 144 DMIPS, 1 MB flash memory, 256 KB SRAM, SMPS
PDF  222 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U375CE Datasheet(HTML) 91 Page - STMicroelectronics

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Symbol
Parameter
Conditions
Min
Typ
Max
Unit
PD
Power
dissipation at
TA = 85 °C for
suffix 6(7)
UFQFPN32
See Section 6.11: Package thermal characteristics
for application appropriate thermal resistance and
package. The power dissipation is then calculated
according to ambient temperature (TA) and
maximum junction temperature (TJ) and selected
thermal resistance.
mW
LQFP48
UFQFPN48
WLCSP52
LQFP64
UFBGA64
WLCSP68-G
WLCSP68-Q
LQFP100
UFBGA100
PD
Power
dissipation at
TA = 105 °C for
suffix 7(7)
UFQFPN32
LQFP48
UFQFPN48
WLCSP52
LQFP64
UFBGA64
WLCSP68-G
WLCSP68-Q
LQFP100
UFBGA100
TA
Ambient
temperature for
suffix 6
Maximum power dissipation
–40
-
85
°C
Low-power dissipation(8)
105
Ambient
temperature for
suffix 7
Maximum power dissipation
105
Low-power dissipation(8)
110
TJ
Junction
temperature
range
Suffix 6 version
-40
-
105
Suffix 7 version
110
1. HSLV means high-speed low-voltage mode (refer to the product reference manual).
2. When RESET is released, the functionality is guaranteed down to VBORx min.
3. In VBAT mode, the functionality is guaranteed down to VBOR_VBAT min.
4. This formula has to be applied only on the power supplies related to the I/O structure described by the pin definition table. The maximum I/O
input voltage is the smallest value between Min (VDD, VDDA, VDDUSB, VDDIO2) + 3.6 V, and 5.5 V.
5. For operation with voltage higher than Min (VDD, VDDA, VDDUSB, VDDIO2) + 0.3 V, the internal pull
‑up and pull‑down resistors must be
disabled.
6. The I/Os powered by VSW are: PC13, PC14, PC15
7. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section 6.11: Package thermal characteristics).
8. In low
‑power dissipation state, TA can be extended to this range as long as TJ does not exceed TJ max (see Section 6.11: Package thermal
characteristics).
5.3.2
Operating conditions at power-up/power-down
The parameters given in the table below are derived from tests performed under the ambient temperature
condition summarized in Table 27.
STM32U375xx
Electrical characteristics
DS14861 - Rev 2
page 91/222



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