R5F10WMDA datasheet(23/126 Pages) RENESAS

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RL78/L13

2. ELECTRICAL SPECIFICATIONS (TA =

−40 to +85°C)

R01DS0168EJ0210 Rev.2.10

Aug 12, 2016

Page 23 of 123

Notes 1.

Total current flowing into VDD, including the input leakage current flowing when the level of the input pin is fixed

to VDD or VSS. The values below the MAX. column include the peripheral operation current. However, not

including the current flowing into the LCD controller/driver, A/D converter, LVD circuit, comparator, I/O port, on-

chip pull-up/pull-down resistors, and the current flowing during data flash rewrite.

When high-speed on-chip oscillator and subsystem clock are stopped.

When high-speed system clock and subsystem clock are stopped.

When high-speed on-chip oscillator and high-speed system clock are stopped. When setting ultra-low power

consumption oscillation (AMPHS1 = 1). The current flowing into the LCD controller/driver, 16-bit timer KB20,

real-time clock 2, 12-bit interval timer, and watchdog timer is not included.

Relationship between operation voltage width, operation frequency of CPU and operation mode is as below.

HS (high-speed main) mode: 2.7 V

≤ VDD ≤ 5.5 V@1 MHz to 24 MHz

2.4 V

≤ VDD ≤ 5.5 V@1 MHz to 16 MHz

LS (low-speed main) mode: 1.8 V

≤ VDD ≤ 5.5 V@1 MHz to 8 MHz

LV (low-voltage main) mode: 1.6 V

≤ VDD ≤ 5.5 V@1 MHz to 4 MHz

Remarks 1.

fMX:

High-speed system clock frequency (X1 clock oscillation frequency or external main system clock

frequency)

fHOCO: High-speed on-chip oscillator clock frequency (48 MHz max.)

fIH:

High-speed on-chip oscillator clock frequency (24 MHz max.)

fSUB:

Subsystem clock frequency (XT1 clock oscillation frequency)

Except subsystem clock operation, temperature condition of the TYP. value is TA = 25

°C

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