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STM32U375CE Datasheet(PDF) 206 Page - STMicroelectronics

Part # STM32U375CE
Description  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 144 DMIPS, 1 MB flash memory, 256 KB SRAM, SMPS
PDF  222 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U375CE Datasheet(HTML) 206 Page - STMicroelectronics

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Table 137. UFBGA100 - Mechanical data
Symbol
millimeters(1.)
inches (12.)
Min.
Typ.
Max.
Min.
Typ.
Max.
A(2.)(3.)
-
-
0.60
-
-
0.0236
A1(4.)
0.05
-
-
0.0020
-
-
A2
-
0.43
-
-
0.0169
-
b(5.)
0.23
0.28
0.33
0.0090
0.0110
0.0130
D
7.00 BSC
0.2756 BSC
D1
5.50 BSC
0.2165 BSC
E
7.00 BSC
0.2756 BSC
E1
5.50 BSC
0.2165 BSC
e(9.)
0.50 BSC
0.0197 BSC
N(10.)
100
SD(11.)
0.25 BSC
0.0098 BSC
SE(11.)
0.25 BSC
0.0098 BSC
aaa
0.15
0.0059
ccc
0.20
0.0079
ddd
0.08
0.0031
eee
0.15
0.0059
fff
0.05
0.0020
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-2009 apart European projection.
2. UFBGA stands for ultra profile fine pitch ball grid array: 0.50 mm < A ≤ 0.65 mm / fine pitch e < 1.00 mm.
3. The profile height, A, is the distance from the seating plane to the highest point on the package. It is measured
perpendicular to the seating plane.
4. A1 is defined as the distance from the seating plane to the lowest point on the package body.
5. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary datum
C.
6. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For tolerances
refer to form and position table. On the drawing these dimensions are framed.
7. Primary datum C is defined by the plane established by the contact points of three or more solder balls that
support the device when it is placed on top of a planar surface.
8. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner chamfer,
ink or metallized markings, or other feature of package body or integral heat slug. A distinguish feature is
allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner
is optional.
9. e represents the solder ball grid pitch.
10. N represents the total number of balls on the BGA.
11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the centre
ball(s) in the outer row or column of a fully populated matrix.
12. Values in inches are converted from mm and rounded to 4 decimal digits.
13. Drawing is not to scale.
STM32U375xx
Package information
DS14861 - Rev 2
page 206/222



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