STM32U375CE datasheet(207/222 Pages) STMICROELECTRONICS

Part #	STM32U375CE

Description	Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 144 DMIPS, 1 MB flash memory, 256 KB SRAM, SMPS

PDF	222 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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207 / 222 page

Figure 84. UFBGA100 - Footprint example

Dsm

Dpad

Table 138. UFBGA100 - Recommended PCB design rules (0.50 mm pitch BGA)

Dimension

Recommended values

Pitch

0.50 mm

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask registration

tolerance)

Stencil opening

0.280 mm aperture diameter

Stencil thickness

Between 0.100 mm and 0.125 mm

6.11

Package thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated using the following

equation:

TJmax=TAmax+ PDmax×ΘJA

where:

•

TA max is the maximum ambient temperature in °C.

•

ΘJA is the package junction-to-ambient thermal resistance in °C/W.

•

PD max is the sum of PINT max and PI/O max:

PDmax=PINTmax+PI/Omax

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power.

PI/O max represents the maximum power dissipation on output pins:

PI/Omax= VOL×IOL + VDDIOx−VOH ×IOH

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the application.

STM32U375xx

Package information

DS14861 - Rev 2

page 207/222

STM32U375CE Datasheet(PDF) 207 Page - STMicroelectronics