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HC705E5GRS/D Datasheet(PDF) 145 Page - NXP Semiconductors |
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HC705E5GRS/D Datasheet(HTML) 145 Page - NXP Semiconductors |
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145 / 148 page ![]() MC68HC705E5 — Rev. 1.0 General Release Specification Ordering Information General Release Specification — MC68HC705E5 Section 17. Ordering Information 17.1 Contents 17.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145 17.3 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145 17.2 Introduction This section contains ordering information. 17.3 MC Order Numbers Table 17-1 shows the MC order numbers for the available package types. Table 17-1. MC Order Numbers Package Type Operating Temperature Range MC Order Number 28-Pin Plastic Dual In-Line Package (PDIP) 0 °C to 70°C MC68HC705E5P 28-Pin Small Outline Integrated Circuit Package (SOIC) 0 °C to 70°C MC68HC705E5DW Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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