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STM32U375CE Datasheet(PDF) 188 Page - STMicroelectronics |
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STM32U375CE Datasheet(HTML) 188 Page - STMicroelectronics |
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188 / 222 page ![]() 6.4 UFQFPN48 package information (A0B9) This UFQFPN is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 71. UFQFPN48 - Outline D2 E2 Terminal 1 idenfier BOTTOM VIEW A C FRONT VIEW SEATING PLANE C eee A3 Terminal 1 Index area E B A C fff M B A C fff M e (see FIG.2) C e B A C fff M ddd M C K C ccc D B A 10 A A (see FIG.2) C aaa x4 TOP VIEW 15 14 2 x R DETAIL C C A1 Seating plane 9 SECTION A-A 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the under side of the UFQFPN48 package. It is recommended to connect and solder this back-side pad to PCB ground. STM32U375xx Package information DS14861 - Rev 2 page 188/222 |
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