STM32U375CE datasheet(190/222 Pages) STMICROELECTRONICS

Part #	STM32U375CE

Description	Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 144 DMIPS, 1 MB flash memory, 256 KB SRAM, SMPS

PDF	222 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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190 / 222 page

6.5

WLCSP52 package information (B0JQ)

This WLCSP is a 52-ball, 3.17 x 3.11 mm, 0.4 mm pitch, wafer level chip scale package.

Figure 73. WLCSP52 - Outline

Seating plane(2)

A1 ball corner(3)

Seating plane(2)

Solder balls

Silicon

Backside coating

FRONT VIEW

TOP VIEW

(marking side)

BOTTOM VIEW

(balls side)

DETAIL A

(Datum A)

Øb (N balls)

Øddd M C A B

(Datum B)

Detail A

(Datum A)

aaa

(4X)

(Datum B)

ccc

bbb

1. Drawing is not to scale.

2. Datum C (seating plane) is defined by the plane established by the contact points of three or more solder balls

that support the device when it is placed on top of a planar surface.

3. The A1 corner is identified on the top surface of the package by using a marking or a physical feature. A

distinguish feature is allowable on the bottom surface of the package to identify the A1 corner. Exact shape of

each corner is optional.

STM32U375xx

Package information

DS14861 - Rev 2

page 190/222

STM32U375CE Datasheet(PDF) 190 Page - STMicroelectronics