STM32U375CE datasheet(191/222 Pages) STMICROELECTRONICS

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Table 131. WLCSP52 - Mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

A(2)

0.58

0.0228

A1(3)

0.14

0.0055

0.38

0.0150

0.025

0.0010

b(4)

0.23

0.25

0.28

0.0091

0.0098

0.0110

D(5)

3.17 BSC

0.1248 BSC

D1(5)

2.43 BSC

0.0957 BSC

E(5)

3.11 BSC

0.1224 BSC

E1(5)

2.40 BSC

0.0945 BSC

eD(5)(6)

0.69 BSC

0.0272 BSC

eE(5)(6)

0.40 BSC

0.0157 BSC

eS(5)(6)

0.40 BSC

0.0157 BSC

N(7)

SD(5)(8)

0.173 BSC

0.0068 BSC

SE(5)(8)

0.200 BSC

0.0079 BSC

aaa(9)

0.02

0.0008

bbb(9)

0.06

0.0024

ccc(9)

0.03

0.0012

ddd(9)

0.015

0.0006

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. The profile height A is the distance from the seating plane to the highest point on the package. It is measured perpendicular

to the seating plane.

3. A1 is defined as the distance from the seating plane to the lowest point on the package body.

4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to Datum C.

5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For tolerances, refer to form

and position table. On the drawing, these dimensions are framed. For the tolerances, refer to form and position values.

6. e represents the solder balls grid pitch(es).

7. N represents the total number of balls.

8. Basic dimensions SD & SE are defining the ball matrix position with respect to datums A and B.

9. Tolerance of form and position drawing

6.5.1

Device marking for WLCSP52

The following figure gives an example of topside marking versus ball A1 position identifier location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below.

STM32U375xx

Package information

DS14861 - Rev 2

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