MSP430F6638IPZ datasheet(24/133 Pages) TI

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8.6 Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)

PARAMETER

VCC

PMMCOREVx

TEMPERATURE (TA)

UNIT

–40°C

25°C

60°C

85°C

TYP

MAX

TYP

MAX

TYP

MAX

TYP

MAX

ILPM3, LCD,

ext. bias

Low-power mode 3

(LPM3) current, LCD 4-

mux mode, external

biasing(1) (2)

3 V

2.3

2.7

3.1

5.4

7.4

11.5

µA

2.3

2.7

5.6

7.5

2.4

2.8

5.8

7.7

2.4

2.8

3.5

5.9

7.9

13.2

ILPM3, LCD,

int. bias

Low-power mode 3

(LPM3) current, LCD 4-

mux mode, internal

biasing, charge pump

disabled(1) (3)

3 V

2.7

3.2

3.8

5.9

7.9

12.2

µA

2.7

3.2

6.1

8.1

2.8

3.3

6.2

8.3

2.8

3.3

4.9

6.4

8.4

13.7

ILPM3

LCD,CP

Low-power mode 3

(LPM3) current, LCD 4-

mux mode, internal

biasing, charge pump

enabled(1) (4)

2.2 V

3.8

µA

3.9

4.0

3 V

4.0

µA

4.1

4.2

(1)

Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation

(XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz

Current for brownout included. Low-side supervisor and monitors disabled (SVSL, SVML). High-side supervisor and monitor disabled

(SVSH, SVMH). RAM retention enabled.

(2)

LCDMx = 11 (4-mux mode), LCDREXT = 1, LCDEXTBIAS = 1 (external biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump

disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)

Current through external resistors not included (voltage levels are supplied by test equipment).

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

(3)

LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump

disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

(4)

LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 1 (charge pump

enabled), VLCDx = 1000 (VLCD = 3 V, typical), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (fLCD = 32768 Hz/32/4 = 256 Hz)

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

8.7 Thermal Resistance Characteristics

PARAMETER

VALUE

UNIT

RθJA

Junction-to-ambient thermal resistance, still air(1)

LQFP (PZ)

122

°C/W

BGA (ZQW)

108

RθJC(TOP)

Junction-to-case (top) thermal resistance(2)

LQFP (PZ)

°C/W

BGA (ZQW)

RθJB

Junction-to-board thermal resistance(3)

LQFP (PZ)

°C/W

BGA (ZQW)

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board,

as specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

MSP430F6638, MSP430F6637, MSP430F6636, MSP430F6635, MSP430F6634

MSP430F6633, MSP430F6632, MSP430F6631, MSP430F6630

SLAS566G – JUNE 2010 – REVISED SEPTEMBER 2020

www.ti.com

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