TUSB7340 datasheet(112/122 Pages) TI2

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9.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.5 Trademarks

Windows XP™ and Windows Vista™ are trademarks of Microsoft Corporation.

TI E2E™ is a trademark of Texas Instruments.

Microsoft® and Windows® are registered trademarks of Microsoft Corporation.

Linux® is a registered trademark of Linus Torvalds.

All trademarks are the property of their respective owners.

9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision P (August 2023) to Revision Q (March 2024)

Page

• Added text "The recommended 1.1-V and 3.3-V power supply ramp time is greater than or equal to 1 ms

(measured from 0% to 100%)" to the Power-Up Sequence section ................................................................31

Changes from Revision O (August 2023) to Revision P (August 2023)

Page

• Updated the Reference Design 1 figure to correct the pin name for A4 and B8.............................................. 25

Changes from Revision N (August 2022) to Revision O (August 2023)

Page

• Updated the format of the Device Information table to include USB port count................................................. 1

• Updated the Power-Up Sequence figure to have VDD11 supply ramp after VDDA_3P3 and VDD33 ............31

Changes from Revision M (July 2015) to Revision N (August 2022)

Page

• Updated the Applications section....................................................................................................................... 1

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated the data sheet to include inclusive terminology................................................................................... 1

• Change recommended VDD11 minimum to 1.045 V from 0.99 V...................................................................... 9

• Added the 1.1 V −5% / +10% supply is recommended footnote for VDD11.......................................................9

• Changed the pin name for B8 in the Reference Design 1 figure from: VDD11 to: NC .................................... 25

TUSB7320, TUSB7340

SLLSE76Q – MARCH 2011 – REVISED MARCH 2024

www.ti.com

112

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TUSB7340 Datasheet(PDF) 112 Page - Texas Instruments

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