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TMS320F2810PBKA Datasheet(PDF) 28 Page - Texas Instruments |
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TMS320F2810PBKA Datasheet(HTML) 28 Page - Texas Instruments |
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28 / 173 page  28 TMS320F2810, TMS320F2811, TMS320F2812 SPRS174U – APRIL 2001 – REVISED JULY 2019 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F2810 TMS320F2811 TMS320F2812 Specifications Copyright © 2001–2019, Texas Instruments Incorporated (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements 5.9 Thermal Resistance Characteristics for 176-Pin PGF Package °C/W(1) RΘJC Junction-to-case thermal resistance 9.73 RΘJA Junction-to-free air thermal resistance 41.88 PsiJT Junction-to-package top 0.247 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements 5.10 Thermal Resistance Characteristics for 128-Pin PBK Package °C/W(1) RΘJC Junction-to-case thermal resistance 10.76 RΘJA Junction-to-free air thermal resistance 41.65 PsiJT Junction-to-package top 0.271 5.11 Thermal Design Considerations Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions. |
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