TMS320F2810PBKA datasheet(6/173 Pages) TI

6 / 173 page

TMS320F2810, TMS320F2811, TMS320F2812

SPRS174U – APRIL 2001 – REVISED JULY 2019

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Product Folder Links: TMS320F2810 TMS320F2811 TMS320F2812

Revision History

•

Table 5-41 (ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise

Noted)—AC Specifications): Changed table title from "AC Specifications" to "ADC Electrical Characteristics Over

Recommended Operating Conditions (Unless Otherwise Noted)—AC Specifications".

.................................. 70

•

Table 5-42 (ADC Electrical Characteristics Over Recommended Operating Conditions (Unless Otherwise

Noted)—DC Specifications): Changed table title from "DC Specifications" to "ADC Electrical Characteristics

Over Recommended Operating Conditions (Unless Otherwise Noted)—DC Specifications".

........................... 71

•

Table 5-42: Removed C281x data.

.............................................................................................. 71

•

Table 5-49 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Updated

footnotes.

............................................................................................................................ 80

•

Table 5-50 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)): Updated

footnote.

............................................................................................................................. 80

•

Table 5-51 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Updated

footnotes.

............................................................................................................................ 81

•

Table 5-52 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)): Updated

footnote.

............................................................................................................................. 81

•

Table 5-53 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Updated

footnotes.

............................................................................................................................ 82

•

Table 5-54 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)): Updated

footnote.

............................................................................................................................. 82

•

Table 5-55 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Updated

footnotes.

............................................................................................................................ 83

•

Table 5-56 (McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)): Updated

footnote.

............................................................................................................................. 83

•

Table 5-61 (Flash Parameters at 150-MHz SYSCLKOUT): Updated "Typical parameters as seen at room

temperature ..." footnote.

.......................................................................................................... 86

•

Table 5-63 (Flash Data Retention Duration): Added table.

................................................................... 87

•

Section 6 (Detailed Description): Changed section title from "Functional Overview" to "Detailed Description".

........ 88

•

Section 6.1.21 (Serial Port Peripherals): Updated description of eCAN.

.................................................... 94

•

Section 6.2.3 (Enhanced Analog-to-Digital Converter (ADC) Module): Updated equations by which the digital

value of the input analog voltage is derived.

.................................................................................. 103

•

Section 6.2.4 (Enhanced Controller Area Network (eCAN) Module): Updated feature about CAN 2.0B.

............. 108

•

Section 6.2.7 (Serial Peripheral Interface (SPI) Module): Updated "Rising edge with phase delay" clocking

scheme.

............................................................................................................................. 120

•

Figure 6-22 (Watchdog Module): Updated figure.

............................................................................ 145

•

Section 7 (Applications, Implementation, and Layout): Added section.

.................................................... 147

•

Section 8 (Device and Documentation Support): Changed title from "Development Support" to "Device and

Documentation Support".

........................................................................................................ 148

•

Section 8.1 (Getting Started): Updated section.

............................................................................... 148

•

Figure 8-1 (TMS320F281x Device Nomenclature): Updated description of Q temperature range.

.................... 149

•

Section 8.3 (Tools and Software): Added section.

........................................................................... 149

•

Section 8.4 (Documentation Support): Updated section.

..................................................................... 150

•

Section 8.5 (Related Links): Added section.

.................................................................................. 152

•

Section 9 (Mechanical, Packaging, and Orderable Information): Replaced "Mechanical Data" section with

"Mechanical, Packaging, and Orderable Information" section.

............................................................. 153

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