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TMS320F2810PBKA Datasheet(PDF) 2 Page - Texas Instruments |
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TMS320F2810PBKA Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 173 page ![]() 2 TMS320F2810, TMS320F2811, TMS320F2812 SPRS174U – APRIL 2001 – REVISED JULY 2019 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F2810 TMS320F2811 TMS320F2812 Device Overview Copyright © 2001–2019, Texas Instruments Incorporated • Package options – 179-ball MicroStar BGA™ with external memory interface (GHH, ZHH) (F2812) – 176-pin Low-Profile Quad Flatpack (LQFP) with external memory interface (PGF) (F2812) – 128-pin LQFP without external memory interface (PBK) (F2810, F2811) • Temperature options – A: –40°C to 85°C (GHH, ZHH, PGF, PBK) – S: –40°C to 125°C (GHH, ZHH, PGF, PBK) – Q: –40°C to 125°C (PGF, PBK) (AEC-Q100 qualification for automotive applications) 1.2 Applications • Advanced Driver Assistance Systems (ADAS) • Building automation • Electronic point of sale • Electric Vehicle/Hybrid Electric Vehicle (EV/HEV) powertrain • Factory automation • Grid infrastructure • Industrial transport • Medical, healthcare, and fitness • Motor drives • Power delivery • Telecom infrastructure • Test and measurement 1.3 Description The TMS320F2810, TMS320F2811, and TMS320F2812 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications. Throughout this document, TMS320F2810, TMS320F2811, and TMS320F2812 are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three devices. (1) For more information on these devices, see Mechanical, Packaging, and Orderable Information. Device Information(1) PART NUMBER PACKAGE BODY SIZE TMS320F2812ZHH MicroStar BGA (179) 12.0 mm × 12.0 mm TMS320F2812GHH MicroStar BGA (179) 12.0 mm × 12.0 mm TMS320F2812PGF LQFP (176) 24.0 mm × 24.0 mm TMS320F2811PBK LQFP (128) 14.0 mm × 14.0 mm TMS320F2810PBK LQFP (128) 14.0 mm × 14.0 mm |
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