TMS320F2810PBKA datasheet(151/173 Pages) TI

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TMS320F2810, TMS320F2811, TMS320F2812

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SPRS174U – APRIL 2001 – REVISED JULY 2019

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Device and Documentation Support

TMS320x281x Serial Communications Interface (SCI) Reference Guide describes the SCI that is a two-

wire asynchronous serial port, commonly known as a UART. The SCI modules support digital

communications between the CPU and other asynchronous peripherals that use the standard non-return-

to-zero (NRZ) format.

TMS320x281x Serial Peripheral Interface Reference Guide describes the SPI—a high-speed synchronous

serial input/output (I/O) port that allows a serial bit stream of programmed length (one to sixteen bits) to be

shifted into and out of the device at a programmed bit-transfer rate. The SPI is used for communications

between the DSP controller and external peripherals or another controller.

Tools Guides

TMS320C28x Assembly Language Tools v18.12.0.LTS User's Guide describes the assembly language

tools (assembler and other tools used to develop assembly language code), assembler directives, macros,

common object file format, and symbolic debugging directives for the TMS320C28x device.

TMS320C28x Optimizing C/C++ Compiler v18.12.0.LTS User's Guide describes the TMS320C28x C/C++

compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly

language source code for the TMS320C28x device.

TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide describes

development using DSP/BIOS.

Application Reports

The SMT & packaging application notes website lists documentation on TI’s surface mount technology

(SMT) and application notes on a variety of packaging-related topics.

Programming Examples for the TMS320x28xx eCAN Application Report contains several programming

examples to illustrate how the eCAN module is set up for different modes of operation. The objective is to

help you come up to speed quickly in programming the eCAN. All programs have been extensively

commented to aid easy understanding.

F2810, F2811, and F2812 ADC Calibration Application Report describes a method for improving the

absolute accuracy of the 12-bit analog-to-digital converter (ADC) found on the F2810/F2811/F2812

devices. Due to inherent gain and offset errors, the absolute accuracy of the ADC is impacted. The

methods described in this application note can improve the absolute accuracy of the ADC to achieve

levels better than 0.5%. This application note is accompanied by an example program (ADCcalibration,

spra989.zip) that executes from RAM on the F2812 eZdsp.

An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS

including its history, advantages, compatibility, model generation flow, data requirements in modeling the

input/output structures and future trends.

Semiconductor Packing Methodology describes the packing methodologies employed to prepare

semiconductor devices for shipment to end users.

Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful

lifetime of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at

general engineers who wish to determine if the reliability of the TI EP meets the end system reliability

requirement.

Calculating FIT for a Mission Profile explains how to use TI's reliability de-rating tools to calculate a

component-level FIT under power-on conditions for a system mission profile.

Semiconductor and IC Package Thermal Metrics describes traditional and new thermal metrics and puts

their application in perspective with respect to system-level junction temperature estimation.

Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders

for serial programming a device.

TMS320F2810PBKA Datasheet(PDF) 151 Page - Texas Instruments

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