26HS01GTAM03 datasheet(159/166 Pages) INFINEON

159 / 166 page

Datasheet

159 of 166

002-12337 Rev. *Y

2022-01-18

256Mb/512Mb/1Gb SEMPER™ Flash

HYPERBUS™ interface, 1.8V/3.0V

Package diagrams

Figure 65

Ball grid array 24-ball 8  8 mm (VAC024)

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX SIZE MD X ME.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, "SD" = eD/2 AND "SE" = eE/2.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW "SD" OR "SE" = 0.

POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.

BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.

DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION

NOTES:

ALL DIMENSIONS ARE IN MILLIMETERS.

0.35

0.00 BSC

1.00 BSC

0.40

0.45

0.20

4.00 BSC

8.00 BSC

1.00

0.00 BSC

DIMENSIONS

SYMBOL

MIN.

NOM.

MAX.

OR OTHER MEANS.

JEDEC SPECIFICATION NO. REF: N/A

10.

002-22282 **

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