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DP83936AVF Datasheet(PDF) 75 Page - National Semiconductor (TI) |
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DP83936AVF Datasheet(HTML) 75 Page - National Semiconductor (TI) |
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75 / 104 page ![]() 80 Network Interfacing (Continued) External ENDEC When EXTe1 the internal ENDEC is by- passed and the signals are provided directly to the user Since SONIC-T’s on-chip ENDEC is the same as National’s DP83910 Serial Network Interface (SNI) the interface con- siderations discussed in this section would also apply to using this device in the external ENDEC mode 81 MANCHESTER ENCODER AND DIFFERENTIAL DRIVER The ENDEC unit’s encoder begins operation when the MAC section begins sending the serial data stream It converts NRZ data from the MAC section to Manchester data for the differential drivers (TXg) In Manchester encoding the first half of the bit cell contains the complementary data and the second half contains the true data (Figure 8-3) A transition always occurs at the middle of the bit cell As long as the MAC continues sending data the ENDEC section remains in operation At the end of transmission the last transition is always positive occurring at the center of the bit cell if the last bit is a one or at the end of the bit cell if the last bit is a zero The differential transmit pair drives up to 50 meters of twist- ed pair AUI cable These outputs are source followers which require two 270X pull-down resistors to ground In addition a pulse transformer is required between the transmit pair output and the AUI interface The driver provides full-step mode for compatibility with Ethernet and IEEE 8023 so that TXa and TXb are equal in the idle state TLF12597 – 53 FIGURE 83 Manchester Encoded Data Stream 811 Manchester Decoder The decoder consists of a differential receiver and a phase lock loop (PLL) to separate the Manchester encoded data stream into clock signals and NRZ data The differential in- put must be externally terminated with two 39X resistors connected in series In addition a pulse transformer is re- quired between the receive input pair and the AUI interface To prevent noise from falsely triggering the decoder a squelch circuit at the input rejects signals with a magnitude less than b175 mV Signals more negative than b300 mV are decoded Once the input exceeds the squelch requirements the de- coder begins operation The decoder may tolerate bit jitter up to 18 ns in the received data The decoder detects the end of a frame within one and a half bit times after the last bit of data 812 Collision Translator When the Ethernet transceiver (DP8392 CTI) detects a colli- sion it generates a 10 MHz signal to the differential collision inputs (CDa and CDb) of the SONIC-T When SONIC-T detects these inputs active its Collision translator converts the 10 MHz signal to an active collision signal to the MAC section This signal causes SONIC-T to abort its current transmission and reschedule another transmission attempt The collision differential inputs are terminated the same way as the differential receive inputs and a pulse transformer is required between the collision input pair and the AUI inter- face The squelch circuitry is also similar rejecting pulses with magnitudes less than b175 mV 813 Oscillator Inputs The oscillator inputs to the SONIC-T (OSCIN and OSCOUT) can be driven with a parallel resonant crystal or an external clock In either case the oscillator inputs must be driven with a 20 MHz signal The signal is divided by 2 to generate the 10 MHz transmit clock (TXC) for the MAC unit The oscilla- tor also provides internal clock signals for the encoding and decoding circuits 8131 External Crystal According to the IEEE 8023 standard the transmit clock (TXC) must be accurate to 001% This means that the os- cillator circuit which includes the crystal and other parts involved must be accurate to 001% after the clock has been divided in half Hence when using a crystal it is nec- essary to consider all aspects of the crystal circuit An ex- ample of a recommended crystal circuit is shown in Figure 8-4 and suggested oscillator specifications are shown in Ta- ble 8-1 The load capacitors in Figure 8-4 C1 and C2 should be no greater than 36 pF each including all stray capacitance (see note 2) The resistor R1 may be required in order to minimize frequency drift due to changes in VCC If R1 is required its value must be carefully selected since R1 decreases the loop gain If R1 is made too large the loop gain will be greatly reduced and the crystal will not oscillate If R1 is made too small normal variations in VCC may cause the oscillation frequency to drift out of specification As a first rule of thumb the value of R1 should be made equal to five times the motional resistance of the crystal The mo- tional resistance of 20 MHz crystals is usually in the range of 10X to 30X This implies that reasonable values for R1 should be in the range of 50X to 150X The decision of whether or not to include R1 should be based upon mea- sured variations of crystal frequency as each of the circuit parameters are varied TLF12597 – 54 FIGURE 8-4 Crystal Connection to the SONIC-T (see text) Note 1 The OSCOUT pin is not guaranteed to provide a TTL compatible logic output and should not be used to drive any external logic If additional logic needs to be driven then an external oscillator should be used as described in the following section Note 2 The frequency marked on the crystal is usually measured with a fixed load capacitance specified in the crystal’s data sheet The actual load capacitance used should be the specified value minus the stray capacitance http www nationalcom 75 |
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