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MC9S08DN60F1CLF Datasheet(PDF) 47 Page - Freescale Semiconductor, Inc |
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MC9S08DN60F1CLF Datasheet(HTML) 47 Page - Freescale Semiconductor, Inc |
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47 / 356 page ![]() Chapter 4 Memory MC9S08DN60 Series Data Sheet, Rev 3 Freescale Semiconductor 47 4.4 RAM The MC9S08DN60 Series includes static RAM. The locations in RAM below 0x0100 can be accessed using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program variables in this area of RAM is preferred. The RAM retains data while the MCU is in low-power wait, stop2, or stop3 mode. At power-on the contents of RAM are uninitialized. RAM data is unaffected by any reset if the supply voltage does not drop below the minimum value for RAM retention (VRAM). For compatibility with M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the MC9S08DN60 Series, it is usually best to reinitialize the stack pointer to the top of the RAM so the direct page RAM can be used for frequently accessed RAM variables and bit-addressable program variables. Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated to the highest address of the RAM in the Freescale Semiconductor equate file). LDHX #RamLast+1 ;point one past RAM TXS ;SP<-(H:X-1) When security is enabled, the RAM is considered a secure memory resource and is not accessible through BDM or code executing from non-secure memory. See Section 4.5.9, “Security”, for a detailed description of the security feature. 4.5 Flash and EEPROM MC9S08DN60 Series devices include Flash and EEPROM memory intended primarily for program and data storage. In-circuit programming allows the operating program and data to be loaded into Flash and EEPROM, respectively, after final assembly of the application product. It is possible to program the arrays through the single-wire background debug interface. Because no special voltages are needed for erase and programming operations, in-application programming is also possible through other software-controlled communication paths. For a more detailed discussion of in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale Semiconductor document order number HCS08RMv1. 4.5.1 Features Features of the Flash and EEPROM memory include: • Array size (see Table 1-1 for exact array sizes) • Flash sector size: 768 bytes • EEPROM sector size: selectable 4-byte or 8-byte sector mapping operation • Single power supply program and erase • Command interface for fast program and erase operation • Up to 100,000 program/erase cycles at typical voltage and temperature • Flexible block protection and vector redirection • Security feature for Flash, EEPROM, and RAM |
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