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26HS01GTAM03 Datasheet(PDF) 147 Page - Infineon Technologies AG

Part # 26HS01GTAM03
Description  256Mb/512Mb/1Gb SEMPER??Flash HYPERBUS??interface, 1.8V/3.0V
PDF  166 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

26HS01GTAM03 Datasheet(HTML) 147 Page - Infineon Technologies AG

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002-12337 Rev. *Y
2022-01-18
256Mb/512Mb/1Gb SEMPER™ Flash
HYPERBUS™ interface, 1.8V/3.0V
Timing characteristics
Notes
70. Applicable across all operating temperature options.
71. Full VCC range and CL = 15pF.
72. Output HI-Z is defined as the point where data is no longer driven.
73. If Reset# is asserted during the end of tPU, the device will remain in the reset state and tRH will determine when CS# may go Low.
74. Sum of tRP and tRH must be equal to or greater than tRPH.
75. Typical program and erase times assume the following conditions: 25°C, VCC = 1.8V and 3.0V; 10,000 cycles; checkerboard data pattern.
76. The programming time for any OTP programming transaction is the same as tPP. This includes PRSSR_4_1.
77. The programming time for the PRPPB_4_0 transaction is the same as tPP. The erase time for ERPPB_0_0 transaction is the same as tSE.
78. Values are guaranteed by characterization and not 100% tested in production.
79. Guaranteed by design.
80. The Joint Electron Device Engineering Council (JEDEC) standard JESD22-A117 defines the procedural requirements for performing valid endurance
and retention tests based on a qualification specification. This methodology is intended to determine the ability of a flash device to sustain repeated
data changes without failure (program/erase endurance) and to retain data for the expected life (data retention). Endurance and retention qualification
specifications are specified in JESD47 or may be developed using knowledge-based methods as in JESD94.
tSE
Sector Erase Time (4KB physical sectors)
–
42
335
ms
–
Sector Erase Time (256KB InfineonEndurance Flex archi-
tecture disabled)
–
773
2677
Sector Erase Time (256KB InfineonEndurance Flex archi-
tecture enabled)
–
773
5869
tBE
Chip Erase Time (256Mb)
–
101
348
sec
–
Chip Erase Time (512Mb)
–
201
696
Chip Erase Time (1Gb)
–
398
1381
tEES
Evaluate Erase Status Time for 4KB physical sectors
(HL256T / HS256T)
(HL512T / HS512T)
(HL01GT / HS01GT)
–
45
76 / 76
51 / 51
53 / 56
µs
–
Evaluate Erase Status Time for 256KB physical sectors
(HL256T / HS256T)
(HL512T / HS512T)
(HL01GT / HS01GT)
–
tDIC_SETUP
Data Integrity Check Calculation Setup Time
(256T / 512T / 01GT)
–
50 / 50 / 17
–
µs
–
tDIC_RATES
Data Integrity Check Calculation Rate (Calculation rate over a
large (>1024-byte) block of data) (HL512T / HS512T / HL01GT /
HS01GT)
55 / 55 / 56 /
56
65
–
MBps
–
tSEC
Sector Erase Count Time
(HL256T / HS256T)
(HL512T / HS512T)
(HL01GT / HS01GT)
–55
87 / 87
63 / 63
70 / 70
µs
–
tBEC1
Blank Check single 256KB sector
–
13
17
ms
–
tBEC2
Blank Check single 4KB sector
–
1
2
tPSWD
Setting the PPB Lock bit after the valid 64-bit password is given
to the device
80
100
120
µs
–
Program, Erase or Data Integrity Check Suspend/Resume Timing
tPEDS
Program/Erase/Data Integrity Check Suspend
–
–
80
µs
–
tPEDRS
Program/Erase/Data Integrity Check Resume to next
Program/Erase/Data Integrity Check Suspend
(256T / 512T / 01GT)
250 / – / –
100 / 100 /
100
–
Table 129
Timing characteristics[70] (Continued)
Symbol
Parameter
Min
Typ
Max
Unit
Reference
figure



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