STM32WBA50KG datasheet(104/110 Pages) STMICROELECTRONICS

104 / 110 page

Package information

STM32WBA50KG

104/110

DS14688 Rev 1

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

6.1

Device marking

Refer to “Reference device marking schematics for STM32 microcontrollers and

microprocessors” (TN1433), available on www.st.com, for the location of pin 1 / ball A1 as

well as the location and orientation of the marking areas versus pin 1 / ball A1.

Parts marked as “ES”, “E” or accompanied by an engineering sample notification letter, are

not yet qualified and therefore not approved for use in production. ST is not responsible for

any consequences resulting from such use. In no event will ST be liable for the customer

using any of these engineering samples in production. ST’s Quality department must be

contacted prior to any decision to use these engineering samples to run a qualification

activity.

A WLCSP simplified marking example (if any) is provided in the corresponding package

information subsection.

6.2

UFQFPN32 package information (A0B8)

This UFQFPN is a 32-pin, 5 x 5 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package.

Figure 27. UFQFPN32 - Outline

1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is mandatory to connect and

A0B8_ME_V3

PIN 1 Identifier

SEATINGPLANE

ddd

STM32WBA50KG Datasheet(PDF) 104 Page - STMicroelectronics