STM32WBA50KG datasheet(106/110 Pages) STMICROELECTRONICS

Part #	STM32WBA50KG

Description	Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33 with FPU, Bluetooth® 5.4 radio solution

PDF	110 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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106 / 110 page

Package information

STM32WBA50KG

106/110

DS14688 Rev 1

6.3

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the specified values.

TJ max (in Celsius degrees), can be calculated using the equation:

TJ max = TA max + (PD max x ΘJA)

where:

•

TA max is the maximum ambient temperature in °C

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max)

•

PINT max is the product of IDD and VDD, expressed in Watt (this is the maximum chip

internal power)

PI/O max represents the maximum power dissipation on output pins:

•

PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 82. Package thermal characteristics

Symbol

Parameter

Package

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFQFPN32 - 5 mm x 5 mm

36.6

°C/W

ΘJB

Thermal resistance junction-board

UFQFPN32 - 5 mm x 5 mm

18.3

ΘJC

Thermal resistance junction-case

UFQFPN32 - 5 mm x 5 mm

14.3

STM32WBA50KG Datasheet(PDF) 106 Page - STMicroelectronics

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